Indigo Xtreme 1366 2Pack

"This is without a doubt The Best PCMA/TIM on the market atm".

Indigo Xtreme™  Socket 1366

for Intel Core™ i7, Core™ 2 Quad, Core™ 2 Extreme, Core™ 2 Duo and Xeon™ processors and AMD Phenom™ and Athlon™ processors

• For Extreme Overclocking

• For Extreme Performance

• For Extreme Reliability

• INSTALLATION GUIDE

  REVIEW by Skinnee Labs

  REVIEW on XS

  COMPATIBILITY NOTES

Indigo Xtreme™ represents a whole new approach to high-performance cooling of your CPU. Indigo Xtreme™ is a precision Engineered Thermal Interface (ETI) that keeps CPUs cooler. Much cooler.

Its innovative and patent-pending structure deploys a highly conductive Phase Change Metal Alloy (PCMA) into all the surface micro-asperities on your CPU lid and heat sink, resulting in the lowest resistance heat path of any thermal interface product available today.

High Thermal Performance

• Bulk thermal conductivity >20 W/mK

• Lowest overall thermal resistance of any TIM available today

• Superior performance right out of the gate

High Reliability

• Fully sealed structure - no mess or migration

• Most consistent performance - applies the correct amount of alloy every time

• Gallium-free

• Laser-cut precision

User Friendly

• Fully compatible with copper and aluminum surfaces

• Peel-and-stick application

• Easy clean up - just peel to remove

   

What is Indigo Xtreme™

Indigo Xtreme™ is an Engineered Thermal Interface (ETI) that fits neatly between a CPU lid and heat sink (or waterblock) to keep CPUs cooler. Unlike greases, metallic thermal interface pads or liquid metal alloys, Indigo Xtreme™ is a self-contained and sealed structure, deploying a Phase Change Metallic Alloy (PCMA) which reflows and fills surface asperities on the CPU lid and heat sink. The resultant interfacial layer is void-free and robust, with low thermal contact and bulk resistance.

How Indigo Xtreme™ Works

The overall thermal performance of a thermal interface is the sum of the bulk thermal resistance (which is the inverse of bulk thermal conductance) of the material and its two surface contact resistances (on both the CPU lid and heat sink). Greases have good surface wetting properties and therefore they exhibit low contact resistance; however, they have high bulk thermal resistances. Metallic pads possess low bulk thermal resistances, but surface oxidation limits their surface wetting ability, resulting in higher contact resistance.

Indigo Xtreme™ achieves high thermal performance through the optimized deployment of molten, oxide-free PCMA, thereby yielding low contact resistance and low bulk resistance.

At the heart of the one-of-a-kind Indigo Xtreme™ ETI is a proven PCMA deployment structure. When heated (see Installation Guide), the sealed deployment structure directs flowing PCMA into CPU lid and heat sink micro-surface asperities while flushing out entrapped air. The asperity filling PCMA creates a corrosion-resistant hermetic (airtight) seal between the lid and heat sink, resulting in long-term reliability.

How to Use Indigo Xtreme™

The Indigo Xtreme™ ETI is offered as part of an Engineered Thermal Interface Kit. This kit includes several cleanroom-grade surface cleaning products to ensure the highest quality deployment possible. Once the CPU lid and heat sink surfaces have been prepared, the ETI is aligned to the lid and held in place with its own adhesive layer. Following the bolting of the heat sink to the motherboard, the ETI may be reflowed by simply running the CPU under load as seen in the video.